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Optical Interconnect and Packaging Conference | UPCOMING

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Hosted by

Lightmatterlightmatter.co

Rethinking the limits of AI, Lightmatter merges photonics and computing to build a future where speed, efficiency, and intelligence converge.

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In-Person

Optical Interconnect and Packaging Conference

Name: Optical Interconnect and Packaging Conference
Start: 2026-06-17
End: 2026-06-17
Location: See event details

Wednesday, June 17, 2026In-Person · Location on official page

Registration

Presented byLightmatter

View on Lightmatter

Event details are available on Lightmatter's website.

Source details last checked Jul 16, 2026.

About this event

June 15-17, 2026 Location: Elizabeth Hotel Fort Collins Presenter: Kaushik Patel, VP, Photonics & Silicon Engineering Title: From Pluggable to Co-Packaged: Scaling Silicon Photonics HVM for CPO. Optical Interconnect and Packaging Conference is an official in-person event listing associated with Lightmatter.

Visit the company-owned event page for the organizer's latest agenda, access details, availability, and registration or viewing instructions. UPCOMING provides this independent listing to help professionals discover the session.

Topics covered

DevOpsCI/CD, infra-as-code, platform engineering.

Frequently asked questions

Who is hosting Optical Interconnect and Packaging Conference?

Optical Interconnect and Packaging Conference is hosted by Lightmatter.

When is Optical Interconnect and Packaging Conference?

Optical Interconnect and Packaging Conference is scheduled for Wednesday, June 17, 2026.

Where does registration take place?

Registration or viewing is completed on Lightmatter's website.

What format is this event?

This is an in-person event.

Which topics does this event cover?

The event covers DevOps.

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