IBM Advanced Semiconductor Packaging and Test Perspective
About this event
1 Passcode: 862998 Host: Steve Crago POC: Amy Kasmir IBM’s Technology Leadership Services organization includes the IBM Semiconductors Division, which is responsible for driving innovation in semiconductor technology for the future of computing. Many of the industry’s most significant breakthroughs—ranging from copper interconnects to the first 2‑nanometer node chip—have.
IBM Advanced Semiconductor Packaging and Test Perspective is an official webinar listing associated with USC Information Sciences Institute. Visit the company-owned event page for the organizer's latest agenda, access details, availability, and registration or viewing instructions. UPCOMING provides this independent listing to help professionals discover the session.
Topics covered
Frequently asked questions
Who is hosting IBM Advanced Semiconductor Packaging and Test Perspective?
IBM Advanced Semiconductor Packaging and Test Perspective is hosted by USC Information Sciences Institute.
When is IBM Advanced Semiconductor Packaging and Test Perspective?
IBM Advanced Semiconductor Packaging and Test Perspective is scheduled for Friday, February 13, 2026 at 4:00 AM.
Where does registration take place?
Registration or viewing is completed on USC Information Sciences Institute's website.
What format is this event?
This is an online webinar.
Which topics does this event cover?
The event covers HR and Data.
